19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2010)
Austin, USA
The general subject of the meeting is the electrical modeling, design, analysis, and characterization of electronic interconnections and packaging structures. The goal of the meeting is to be the leading conference dealing with advanced and emerging issues in electrical design of interconnect structures and assurance of signal integrity. Authors are invited to submit papers describing new technical contributions in the areas broadly covered below:
- Current and future issues related to system level and on-chip interconnections
- Microsystem and 3D structures and their electrical performance
- RF/microwave packaging structures and their electrical performance
- Design of high speed channels, including jitter and noise budgets
- Design of memory and DDR interfaces
- Circuit design techniques for high-speed serial links
- Electrical design, modeling and analysis techniques applicable to signal integrity of interconnect structures
- Electrical design, modeling and analysis techniques applicable to integrity of power delivery at the system and chip levels
- New and innovative interconnect packaging structures and their electrical performance
- Measurement and data analysis techniques for system-level and on-chip structures
- Signal integrity in mixed signal and RF integrated circuits and modules
- Electromagnetic modeling and simulation tools and flows
- Advances in transmission-line techniques
- Macromodeling and model reduction as it applies to electrical analysis